Actalent Semiconductor Industry


Fueled by upwards of $500B in private investment and CHIPS Act funding, all that’s lacking in the race to re-shore U.S. semiconductor manufacturing is engineering talent and the certainty of a stabilized supply chain.

Fabless companies, equipment manufacturers, integrated device manufacturers and foundries, including all their suppliers, will need strategic partners to overcome scarcity, optimize investments and create competitive advantages.

Actalent: The Semiconductor Industry’s Strategic Partner.

We help stakeholders in the semiconductor industry:

  • Bridge critical engineering workforce and capabilities gaps.
  • Strengthen their supply chain visibility, security and resiliency.
  • Seize monumental CHIPs Act funding opportunities.

Semiconductor Excellence:
Why Partner With Actalent?

Actalent has been a leading provider of electrical, mechanical, systems and software and manufacturing engineering services and engineering workforce solutions for over forty years.

  • We are the number one provider of engineering talent in the U.S. and the number two provider in the world (Staffing Industry Analysts rankings 2023).
  • Our services teams are comprised of world-class engineers with decades of technical, project management and leadership experience. As such, we deliver a multitude of customized, flexible, and scalable engineering services and solutions.
  • Actalent is a semiconductor talent hub. We have more than 2,500 engineers with key industry skill sets already working for us, plus direct access to thousands more that we can quickly source from within our national and global talent networks.
  • Strategic recruiting, engagement and retention experts. We can find, screen, train, onboard and performance manage an entire engineering workforce with unparalleled speed-to-market, operational efficiency, quality and results.

In short, no organization is more experienced, more equipped or better prepared to support the semiconductor industry with scalable engineering talent and services solutions than Actalent.


  • PMI PMP certified project managers
  • Certified CAD professionals
  • Certified GD&T Technologist
  • Functional Safety Certified Engineers (ISO26262)
  • Certified AGILE Scrum Masters

Actalent's Semiconductor Expertise

  • We help our clients design, manufacture and package the world’s most advanced semiconductors.
  • We improve product speed-to-market with on-time, first time right deliverables.
  • We align processes and deliverables with new and advanced technologies.
  • We ensure chipmaking equipment and components are designed, assembled, installed and commissioned in accordance with standardized safety and operational specifications.
  • We ensure materials and substrates are sourced, documented, stored and handled properly.

Semiconductor Talent We Supply

Systems Engineering

  • FPGA & ASIC Design
  • Machine Learning and Machine Vision

Embedded Systems Development

  • Firmware Design and Development
  • Hardware Design and Development
  • Product Planning and Design Life Cycle Management
  • C++ Embedded Control

Full-Stack Software Development

  • Devops
  • Continuous Integration/Continuous Deployment

Value Engineering

  • Obsolescence/End of Life Engineering

Product Supply Chain Management

Verification and Validation

  • Equipment, Process, Metrology, Engineering, Manufacturing and Maintenance Technicians and Engineers
  • Quality Services
  • Validation
  • Testing Services
  • Plant Engineering
  • Manufacturing and Industrial Engineering
  • Controls and Automation Engineering
  • Mechanical Systems Development
  • Electrical Systems Development
  • Electromechanical Engineering
  • Product Sustenance
  • Obsolescence Engineering
  • Procurement and Supply Chain
  • Project Controls
  • Construction Management
  • EHS and Quality

Looking to build a high-performing engineering team?
Connect with an Actalent expert.

Actalent's Global Footprint

Actalent’s full suite of workforce management solutions are flexible, scalable and customizable to align with each of our client’s individual goals and requirements. And, with more than 150 offices in the U.S. and Canada, plus 16 delivery centers located throughout North America, India, Great Britain, Switzerland, Germany and Australia, our engineering services can be deployed on-shore, off-shore, on-site, off-site, near-site and/or using remote delivery models.

U.S. Semiconductor
Industry Trends

*Based on BLS & Semiconductor Industry Association Data

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Semiconductor FAQs

These are some of the main factors driving growth in the semiconductor industry:

  • Digitalization, electrification and technological advancements like AI and automation.
  • A need to re-shore advanced chip manufacturing to improve supply chain resiliency.
  • Nearly $450 billion in private investment.
  • $52.7 billion in federal CHIPS Act Funding.

The following are among the most in-demand skill sets across the semiconductor industry:

  • Software developer/engineer
  • Application developer/engineer
  • Manufacturing process engineer
  • Industrial engineer
  • Electrical engineer

The U.S. semiconductor industry will have to address the following challenges as it looks to re-shore chip manufacturing:

  • Talent shortages
  • Both implementing manufacturing processes and the cost of manufacturing
  • Standardization of materials, processes, and equipment
  • Supply chain integrity
  • Advanced packaging
  • Microelectronics manufacturing
  • Improving tools for modeling and simulating semiconductor materials

These are the key steps in the semiconductor manufacturing process:

  • Deposition: thin films of conducting, isolating, or semiconducting materials are deposited on the surface of a silicon wafer.
  • Photoresist coating: wafers are coated in materials that chemically react to light.
  • Lithography: ultraviolet light is used to transfer patterns onto a wafer.
  • Etching: degraded photoresist coating materials are removed from the wafer, leaving only the pattern.
  • Ion implantation: positive or negative ions are implanted into the wafer’s silicon crystals to control the flow of electricity.
  • Packaging: the process of cutting and packaging chips after they have been fabricated on a wafer.
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